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This technology (AERoBOND) enables the assembly of large-scale, complex composite structures while maintaining predictable mechanical and material properties. It does so by using a novel barrier-ply technology consisting of an epoxy resin/prepreg material with optimal efficiency, reliability, and performance. The barrier-ply materials prevent excessive mixing between conventional composite precursors and stoichiometrically-offset epoxy precursors during the cure process by forming a gel early in the cure cycle before extensive mixing can occur. The barrier ply is placed between the conventional laminate preform and the stoichiometrically-offset ply or plies placed on the preform surface, thus preventing excessive mass transfer between the three layers during the cure process. In practice, the barrier ply could be combined with the offset ply to be applied as a single, multifunctional surfacing layer enabling unitized assembly of large and complex structures. The AERoBOND method is up to 40% faster than state-of-the-art composite manufacturing methods, allows for large-scale processing of complex structures, eliminates the potential for weak bond failure modes, and produces composites with comparable mechanical properties as compared with those prepared by co-cure.

Deployable space structures often rely upon telescoping or folding structures that either must be manually deployed or deployed by attached motors. These structures are often made from heavier (relative to carbon fiber composites) metals to provide enough strength to support a load. As such, there is a need for in-space structures that are lightweight, can be packaged compactly, and can be deployed easily. The composite material developed here does not require high temperature baking to cure the polymer, rather relying on UV light to solidify the polymer component. The composite is then included into origami-based structures that can fold and deploy using the polymer shape memory effect. The composite is first trained to assume the deployed structural shape when heated; it is then folded like origami and frozen into the packaged shape for storage and launch. Combining the composite material with the origami-inspired design leads to high strength structures (can hold at least 600 kg on Earth). To date, a ~5-inch prototype structural bar has been produced using the UV-curable composite and further development is on-going at NASA Langley. The deployable origami composite structures are at technology readiness level (TRL) 4 (component and/or breadboard validation in laboratory environment) and are available for patent licensing.

The new composite developed by NASA incorporates PGS and CNTs to enhance its thermal conductivity while preserving the mechanical properties of the underlying carbon fiber polymer composite. NASA has also improved the composite manufacturing process to ensure better thermal conductivity not only on the surface, but also through the thickness of the material. This was achieved by adding perforations that enable the additives to spread through the composite. The process for developing this innovative, highly thermally conductive hybrid carbon fiber polymer composite involves several steps. Firstly, a CNT-doped polymer resin is prepared to improve the matrix's thermal conductivity, which is then infused into a carbon fiber fabric. Secondly, PGS is treated to enhance its mechanical interface with the composite. Thirdly, perforation is done on the pyrolytic graphite sheet to improve the thermal conductivity through the thickness of the material by allowing CNT-doped resin to flow and better interlaminar mechanical strength. Finally, the layup of PGS and CNT-CF polymer is optimized. Initial testing of the composite has shown significant increases in thermal conductivity compared to typical carbon fiber composites, with a more than tenfold increase. The composite also has higher thermal conductivity than aluminum alloys, with more than twice the thermal conductivity of the Aluminum 6061 typically used in the aerospace industry. For this new material, NASA has completed a proof-of-concept demonstration and work continues to use the material in a heat exchanger system and further characterize the properties including longevity and radiation impact analysis.

Many researchers have attempted to use polymer-ceramic composites to improve the thermal and dielectric performance of polymer insulation for high voltage, high temperature electronics. However, using composite materials has been challenging due to manufacturing issues like incomplete mixing, inhomogeneous properties, and void formation. Here, NASA has developed a method of preparing and extruding polymer-ceramic composites that results in high-quality, flexible composite ribbons. To achieve this, pellets of a thermoplastic (e.g., polyphenylsulfone or PPSU) are coated with an additive then mixed with particles of a ceramic (e.g., boron nitride or BN) as shown in the image below. After mixing the coated polymer with the ceramic particles, the blended material was processed into ribbons or films by twin-screw extrusion. The resulting ribbons are highly flexible, well-mixed, and void free, enabled by the coated additive and by using a particle mixture of micronized BN and nanoparticles of hexagonal BN (hBN). The polymer-ceramic composite showed tunable dielectric and thermal properties depending on the exact processing method and composite makeup. Compared to the base polymer material, the composite ribbons showed comparable or improved dielectric properties and enhanced thermal conductivity, allowing the composite to be used as electrical insulation in high-power, high-temperature conditions. The related patent is now available to license. Please note that NASA does not manufacturer products itself for commercial sale.